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Processes.
1.- Incoming inspection of material (acquired, customer provided, consigned).
2.- Custom profiles for SMD solder reflow, and solder paste curing,
3.- Conductive flooring, conductive smocks, ESD wrist straps used,
4.- Controlled environment (refrigerated),
5.- Process engineering available on site,
6.- Ability to translate product math data to XY coordinates,
7.- Processes run under controlled and fully documented conditions,
8.- ESD protection verification on a daily basis,
9.- Final inspection of all products (100% visual inspection), electrical test
can be accommodated via custom fixturing and equipment,
10.- Product design critique for manufacturability and assembly,
(continuous improvement),
11.- Findings report for each prototype and pilot runs,
12.- Ability to document PFMEA, PCP (quality plans), MSA studies
(gauge R & R, linearity, stability, bias), statistical process control,
SPC charting, statistical, statistical sampling inspection,
Capability Studies, PPAP,
13.- Familiar and able to apply 6 sigma methodology for process
improvement (Define,Measure, Analyze,Improve, Control).
DOE full factorial, fractional factorial, response surface DOE techniques.
14.- Ability to document incidents in 5 phase, 8D or any custom document for
corrective action purposes,
15.- Lot traceability.
Manufacturing capabilities and current capacity.
SMD placement capabilities
· 0201 8 mm paper tape
· TSOPs, CSPs, BGAs, QFPs placement capability
· Gray scale vision system
· Tray module 56 mm2
· 194 (8mm) feeder inputs
· Fiducial mark recognition
SMD Placement Capacity
· 80, 000 components/ hour
Equipment Installed
· Screen printer Panasonic SP and MPM.
· Glue dispensing machine Panasert
Universal fine pitch and chip shooter.
· Chip shooter machine Panasonic MK-11 136 feeder inputs,
0.14 tact time
· Fine pitch placement machine SAMSUNG S-2000
· Reflow Vitronics and ven ( 7 Zones)
· Workbenches and solder stations
Quality system is compliance with ISO 9002 by the end of December 2003
Management Experience.
1.- Manufacturing management with more than 12 years in the automatic
assembly area with axial insertion, radial insertion, and surface
mount technologies.
2.- Quality management with more than 15 years in the automotive
industry. We are familiar and can comply with all contracted
requirements of ISO-9000 and QS-9000.
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Through hole automatic insertion.
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Gray scale vision system.
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Product data math to XY coordinates
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BGA assembly and reballing
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